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SINGAPORE, Feb. 1, 2022 /PRNewswire/ — Kulicke and Soffa Industries, Inc. (NASDAQ:KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), a global leader in the design and manufacture of semiconductor, LED and electronic assembly equipment, announced it is expanding its Thermal Compression Bonding (TCB) capabilities to accelerate innovation in the integration of semiconductor and Silicon Photonics. Multi-Chip integration is a fast-growing assembly trend supporting transistor-level density at the package level for both high-volume semiconductors and also leading-edge assembly.
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